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Asia-Pacific Semiconductor Packaging and Assembly (P&A) Equipment Market: Insights and Forecast 2018-2025: Emphasis on Process Type (Plating, Inspection and Dicing, Wire Bonding, Die-Bonding, Others (Including Packaging)), Application (Consumer Electronics, Communication, Automotive, Industrial, Other) and Country

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The report published" Asia Pacific Semiconductor Packaging and Assembly Equipment Market Insights to 2025 - provides a comprehensive analysis of Semiconductor Packaging and Assembly Equipment market at regional level. The report focuses on overall market size for Semiconductor Packaging and Assembly Equipment services by several Process (Plating, Inspection and Dicing, Wire Bonding, Die-Bonding and Others (including Packaging)), by applications (Consumer Electronics, Communication, Automotive, Industrial and Others), by different countries such as China, Japan, India, South Korea, Singapore, Taiwan and rest of APAC.
The report also provides a holistic view of the overall semiconductor packaging and assembly equipment market in the region as well as growth drivers, restraints, opportunities and factor analysis in terms of top investments undertaken, top product launches, major merger and acquisitions.
For an in-depth market overview, the report also includes a country wise analysis. For all the top industry players, a detailed product description, short- and long-term strategies, financials, SWOT analysis and recent developments are also included in the regional semiconductor packaging and assembly equipment market report. In addition to this, Porter 5s along with market share of leading semiconductor packaging and assembly equipment companies by application (Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Samsung Electronics Co Ltd, Jiangsu Changjiang Electronics Technology Co., Ltd, ChipMOS Technologies Inc., Powertech Technologies Inc., ASE Group, Renesas Electronics Corporation) have also been covered.
Asia Pacific Semiconductor Packaging and Assembly Equipment Market Size
In terms of revenue, the semiconductor packaging and assembly equipment in Asia Pacific has registered an astonishing growth with positive CAGR during the forecast period (2019-2025). The semiconductor packaging and assembly equipment market in Asia Pacific has witnessed an overall rise in market penetration in the last few years. The Internet of Things and automation in automobiles has boosted the semiconductor market. The usage of semiconductor ICs for automated driving, automatic braking system, GPS, power doors and windows has further escalated the market growth.
Asia Pacific Semiconductor Packaging and Assembly Equipment Market Segmentation
Segmentation by Process
The die bonding process held the dominant share in semiconductor packaging and assembly equipment market. baseband is mostly integrated into mobile and consumer electronics devices, this is propelling the dominance of die bonding in the market. Plating process is anticipated to be the fastest growing.
Segmentation by Application
Semiconductor packaging and assembly equipment technology market in Asia Pacific fetched maximum revenues from communication. On the other hand, automotive application segment is expected to display a high growth in years to come due to the increase in demand of automated automobiles.
Segmentation by Country
Taiwan takes the upper hand in the semiconductor packaging and assembly equipment technology market followed by China. Taiwan remains well ahead of China in IC fabrication as Taiwanese manufacturers have enormous advantages in technology over other countries including China.
Scope of the report:
Asia Pacific Asia Pacific Semiconductor Packaging and Assembly Equipment Market
Market Segmentation
Market Insights, by Market Insights by Process
Plating
Inspection and Dicing
Wire Bonding
Die-Bonding
Others (including Packaging)
Market Insights by Application
Consumer Electronics
Communication
Automotive
Industrial
Others
Market Insights by Geography
China
Japan
India
South Korea
Singapore
Taiwan
Rest of APAC
Top Companies Profiled
Amkor Technology Inc.
Fujitsu Ltd.
Toshiba Corporation
Qualcomm Incorporated
Samsung Electronics Co Ltd
Jiangsu Changjiang Electronics Technology Co., Ltd
ChipMOS Technologies Inc.
Powertech Technologies Inc.
ASE Group
Renesas Electronics Corporation
Reasons to buy:
The study includes market sizing and forecasting analysis validated by authenticated key industry experts
The report presents a quick review of overall industry performance at one glance
The report covers in depth analysis of prominent industry peers with primary focus on key business financials, product portfolio, expansion strategies and recent developments
Detailed examination on drivers, restraints, key trends and opportunities prevailing in the industry.
Examination of industry attractiveness with the help of Porter's Five Forces analysis
The study comprehensively covers the market across different segments
Deep dive regional level analysis of the industry
Customization Options:
The Asia Pacific Semiconductor Packaging and Assembly Equipment Market can be customized to country level or any other market segment. Besides this, UMI understands that you may have your own business need, hence we also provide fully customised solutions to clients.
READ MORE

Table Of Content

Scope

1. MARKET INTRODUCTION 11

1.1 Market Definition 11

1.2 Objective of the Study 11

1.3 Limitation 11

1.4 Stakeholders 11

1.5 Currency used in the Report 12

2. RESEARCH METHODOLOGY OR ASSUMPTION 13

2.1 Research Methodology for Asia-Pacific Semiconductor P&A Equipment Market 13

2.1.1 Main objective of the Asia-Pacific Semiconductor P&A Equipment Market Study 14

3. INDUSTRY PERFORMANCE 15

4. EXECUTIVE SUMMARY 16

5. MARKET OVERVIEW 18

5.1 Introduction 18

5.2 Market Dynamics 19

5.2.1 Market Trend & Drivers 19

5.2.1.1 Increase in Sales of Smart Phones and Other Smart Consumer Electronic Devices 19

5.2.1.2 Improved Medical Applications and Equipment 20

5.2.1.3 Growing Scope in the Internet of Things 21

5.2.1.4 Increase in Vehicle Automation 23

5.2.2 Market Restraints 23

5.2.2.1 The requirement of High Investment 23

5.2.3 Market Opportunities 24

5.2.3.1 Rise in Use of 3D Packaging technology 24

5.2.3.2 Development of new Assembly Process 25

5.3 Key Market Indicators 26

5.3.1 Demand and Supply Side Analysis 26

5.3.1.1 Top Winning Strategies 26

5.3.1.1.1 Top Product launches 27

5.3.1.1.2 Business Expansions 28

5.3.1.1.3 Top Acquisition, Partnerships, Collaborations 28

5.3.2 Value Chain Analysis 29

6. MARKET INSIGHTS by PROCESS TYPE 31

6.1 General Overview 31

6.2 Plating 32

6.3 Inspection and Dicing 33

6.4 Wire Bonding 34

6.5 Die-Bonding 35

6.6 Others (Including Packaging) 36

7. MARKET INSIGHTS BY APPLICATION 37

7.1 General Overview 37

7.2 Consumer Electronics 38

7.3 Communication 39

7.4 Automotive 40

7.5 Industrial 41

7.6 Other Industry 42

8. MARKET INSIGHTS BY COUNTRY 43

8.1 General Overview 43

8.1.1 APAC Semiconductor P&A Equipment Market by Country, 2018-25 43

8.1.1.1 China Semiconductor P&A Equipment Market 44

8.1.1.1.1 Chinese Export Import data of Semiconductor Devices (2012-2018) 45

8.1.1.1.2 China Semiconductor P&A Equipment Market Size, 2018-25 45

8.1.1.2 Japan Semiconductor P&A Equipment Market 46

8.1.1.2.1 Production Value of Japanese Electronic Industry (2012-2017) 47

8.1.1.2.2 Japan Export Import data of Semiconductor Devices (2012-2018) 48

8.1.1.2.3 Japan Semiconductor P&A Equipment Market Size, 2018-25 48

8.1.1.3 India Semiconductor P&A Equipment Market 49

8.1.1.3.1 Key notable developments in Semiconductor & Electronic Sector 50

8.1.1.3.2 Key Government Initiative for Semiconductor & Electronic Sector 51

8.1.1.3.3 India Export Import data of Semiconductor Devices (2012-2018) 52

8.1.1.3.4 India Semiconductor P&A Equipment Market Size, 2018-25 52

8.1.1.4 Singapore Semiconductor P&A Equipment Market 53

8.1.1.4.1 Singapore Export Import data of Semiconductor Devices (2012-2018) 54

8.1.1.4.2 Singapore Semiconductors Market size and Local Production (2015-18) 54

8.1.1.4.3 Singapore Semiconductor P&A Equipment Market Size, 2018-25 55

8.1.1.5 South Korea Semiconductor P&A Equipment Market 56

8.1.1.5.1 South Korea Export Import data of Semiconductor Devices (2012-2018) 56

8.1.1.5.2 South Korea Semiconductor P&A Equipment Market Size, 2018-25 57

8.1.1.6 Taiwan Semiconductor P&A Equipment Market 58

8.1.1.6.1 Taiwan Semiconductor Equipment Market & Local Production (2015-18) 58

8.1.1.6.2 Taiwan Export Import data of Semiconductor Devices (2011-2017) 59

8.1.1.6.3 Taiwan Semiconductor P&A Equipment Market Size, 2018-25 59

8.1.1.7 Rest of APAC Semiconductor P&A Equipment Market 60

8.1.1.7.1 Malaysia Semiconductor Production, 2013-2017 (USD billion) 61

8.1.1.7.2 Malaysia Export Import data of Semiconductor Devices (2012-2018) 61

8.1.1.7.3 Rest of APAC Semiconductor P&A Equipment Market Size, 2018-25 62

9. COMPETITIVE SCENARIO 64

9.1 Porter's Five Forces Analysis 64

9.1.1 Bargaining power of Buyer 64

9.1.2 Bargaining power of Supplier 65

9.1.3 Threat of new entrants 65

9.1.4 Availability of Substitute 65

9.1.5 Industry Rivalry 65

9.2 APAC Semiconductor P&A Equipment Market Share Analysis, 2018 66

10. TOP COMPANY PROFILES 68

10.1 Amkor Technology Inc. 68

10.1.1 Key Facts 68

10.1.2 Business Description 68

10.1.3 Key Product/Services Offerings 69

10.1.4 SWOT Analysis 70

10.1.5 Key Financials 71

10.1.5.1 Revenue Split 71

10.1.6 Recent Developments 72

10.2 Fujitsu Ltd. 73

10.2.1 Key Facts 73

10.2.2 Business Description 73

10.2.3 Key Product/Services Offerings 74

10.2.4 SWOT Analysis 74

10.2.5 Key Financials 75

10.2.5.1 Revenue Split 75

10.2.6 Recent Developments 76

10.3 Toshiba Corporation 77

10.3.1 Key Facts 77

10.3.2 Business Description 77

10.3.3 Key Product/Services Offerings 78

10.3.4 SWOT Analysis 79

10.3.5 Key Financials 79

10.3.6 Revenue Split 80

10.3.7 Recent Developments 80

10.4 Qualcomm Incorporated 82

10.4.1 Key Facts 82

10.4.2 Business Description 82

10.4.3 Key Product/Services Offerings 83

10.4.4 SWOT Analysis 83

10.4.5 Key Financials 84

10.4.5.1 Revenue Split 84

10.4.6 Recent Developments 85

10.5 Renesas Electronics Corporation 86

10.5.1 Key Facts 86

10.5.2 Business Description 86

10.5.3 Key Product/Services Offerings 87

10.5.4 Growth Strategy 87

10.5.5 SWOT Analysis 88

10.5.6 Key Financials 88

10.5.6.1 Revenue Split 89

10.5.7 Recent Developments 89

10.6 Samsung Electronics Co. Ltd. 90

10.6.1 Key Facts 90

10.6.2 Business Description 90

10.6.3 Key Product/Services Offerings 91

10.6.4 SWOT Analysis 92

10.6.5 Key Financials 92

10.6.5.1 Revenue Split 93

10.6.6 Recent Developments 93

10.7 Jiangsu Changjiang Electronics Technology Co., Ltd. 94

10.7.1 Key Facts 94

10.7.2 Business Description 94

10.7.3 Key Product/Services Offerings 94

10.7.4 SWOT Analysis 95

10.7.5 Key Financials 95

10.7.5.1 Revenue Split 96

10.7.6 Recent developments 96

10.8 ChipMOS Technologies Inc. 97

10.8.1 Key Facts 97

10.8.2 Business Description 97

10.8.3 Key Product/Services Offerings 98

10.8.4 Growth Strategy 98

10.8.5 SWOT Analysis 98

10.8.6 Key Financials 99

10.8.6.1 Revenue Split 99

10.8.7 Recent developments 100

10.9 Powertech Technology Inc. 101

10.9.1 Key Facts 101

10.9.2 Business Description 101

10.9.3 Key Product/Services Offerings 102

10.9.4 Growth Strategy 102

10.9.5 SWOT Analysis 103

10.9.6 Key Financials 103

10.9.6.1 Revenue Split 104

10.9.7 Recent developments 104

10.10 ASE Group 105

10.10.1 Key Facts 105

10.10.2 Business Description 105

10.10.3 Key Product/Services Offerings 106

10.10.4 Growth Strategy 106

10.10.5 SWOT Analysis 107

10.10.6 Key Financials 107

10.10.6.1 Revenue Split 108

10.10.7 Recent developments 10


List Of Figure

FIG. 1 Research Methodology for Asia-Pacific Semiconductor P&A Equipment Market Study 13

FIG. 2 APAC Semiconductor P&A Equipment Market Size, 2018-25 (USD million) 17

FIG. 3 History of Semiconductor P&A Equipment Market 18

FIG. 4 Smartphone Unit Shipments and Sales Value in Asia Pacific, 2013-2017 19

FIG. 5 Smartphone Unit Shipments and Market share, by Company in Southeast Asia 2017 20

FIG. 6 Global Electronic Health Record market share, by Company 2016 21

FIG. 7 Number of Consumer Electronics Devices in India, 2014 and 2020, (Unit in million) 22

FIG. 8 Asia Pacific IoT connections, Current and Forecast (2018-2025) 22

FIG. 9 YoY Growth of Automotive Semiconductor vs all Semiconductor 23

FIG. 10 Investment Payback Time, for Foundries Manufacturing Nodes Smaller than 20 nm/16 nm (in months) 24

FIG. 11 Semiconductor Manufacturing Processes Overview 25

FIG. 12 Value Chain of Semiconductor P&A Equipment Market 29

FIG. 13 APAC Semiconductor P&A Equipment Market Share by Process, 2018 & 2025 (%) 31

FIG. 14 APAC Semiconductor P&A Equipment Market size by Process, 2018-25 (USD million) 31

FIG. 15 APAC Semiconductor P&A Equipment Market Share by Application, 2018 & 2025 (%) 37

FIG. 16 APAC Semiconductor P&A Equipment Value by Application, (2018-25), (USD million) 37

FIG. 17 APAC Semiconductor P&A Equipment Market Share by Country, 2018 & 2025 (%) 43

FIG. 18 YOY growth of Electronics Brand in Chinese Market (Unit: million? 44

FIG. 19 Chinese Export & Import data for Diodes, Transistors and Similar Semiconductor Devices, USD million 45

FIG. 20 China Semiconductor P&A Equipment Market Size, 2018-2025 (USD million) 45

FIG. 21 Production Value of Japanese Electronic Industry, 2011-2017 (USD million) 47

FIG. 22 Japan Export & Import data for Diodes, Transistors and Similar Semiconductor Devices, USD million 48

FIG. 23 Japan semiconductor P&A Equipment Market Size, 2018-2025 (USD million) 48

FIG. 24 India Export & Import data for Diodes, Transistors and Similar Semiconductor Devices, USD million 52

FIG. 25 India semiconductor P&A Equipment Market Size, 2018-2025 (USD million) 52

FIG. 26 Singapore Export & Import data for Diodes, Transistors and Similar Semiconductor Devices, USD million 54

FIG. 27 Singapore Semiconductors Market size and Local Production (2015-18), USD million 54

FIG. 28 Singapore semiconductor P&A Equipment Market Size, 2018-2025 (USD million) 55

FIG. 29 South Korea Export & Import data for Diodes, Transistors and Similar Semiconductor Devices, USD million 56

FIG. 30 South Korea Semiconductor P&A Equipment Market Size, 2018-2025 (USD million) 57

FIG. 31 Taiwan Semiconductors Manufacturing Market size and Local Production (2015-18), USD million 58

FIG. 32 Taiwan Export & Import data for Diodes, Transistors and Similar Semiconductor Devices, USD million 59

FIG. 33 Taiwan Semiconductor P&A Equipment Market Size, 2018-2025 (USD million) 59

FIG. 34 Malaysia Semiconductor Production, 2013-2017 (USD billion) 61

FIG. 35 Malaysia Export & Import data for Diodes, Transistors and Similar Semiconductor Devices, USD million 61

FIG. 36 Rest of APAC Semiconductor P&A Equipment Market Size, 2018-2025 (USD million) 62

FIG. 37 Porters' Five Forces Analysis on Asia-Pacific Semiconductor P&A Equipment Market 64

FIG. 38 APAC Semiconductor P&A Equipment Market Share by Company 2018 66

FIG. 39 Amkor Technology Inc., SWOT Analysis 70

FIG. 40 Amkor Technology Inc., Revenue Split, 2017 71

FIG. 41 Fujitsu Ltd., SWOT Analysis 74

FIG. 42 Fujitsu Ltd., Revenue Split, 2017 75

FIG. 43 Toshiba Corporation, SWOT Analysis 79

FIG. 44 Toshiba Corporation Revenue Split, 2018 80

FIG. 45 Qualcomm Incorporated SWOT Analysis 83

FIG. 46 Qualcomm Incorporated Revenue Split, 2018 84

FIG. 47 Renesas Electronics Corporation SWOT Analysis 88

FIG. 48 Renesas Electronics Corporation Revenue Split, 2018 89

FIG. 49 Samsung Electronics SWOT Analysis 92

FIG. 50 Samsung Electronics Revenue Split, 2017 93

FIG. 51 Jiangsu Changjiang Electronics Technology Co. Ltd. SWOT Analysis 95

FIG. 52 Jiangsu Changjiang Electronics Technology Co. Ltd 2017 96

FIG. 53 ChipMOS Technologies Inc., SWOT Analysis 98

FIG. 54 ChipMOS Technologies Inc. Revenue Split, 2018 99

FIG. 55 Powertech Technology Inc. SWOT Analysis 103

FIG. 56 Powertech Technology Inc., Revenue Split, 2017 104

FIG. 57 ASE Group, SWOT Analysis 107

FIG. 58 ASE Group Revenue Split, 2017 108


List Of Table

TABLE 1 APAC Plating Semiconductor Equipment Market by Country, (2018-25), (USD million) 32

TABLE 2 APAC Inspection & Dicing Semiconductor Equipment Market by Country, (2018-25) (USD million) 33

TABLE 3 APAC Wire Bonding Semiconductor Equipment Market by Country, (2018-25), (USD million) 34

TABLE 4 APAC Die Bonding Semiconductor Equipment Market by Country, (2018-25), (USD million) 35

TABLE 5 APAC Others Semiconductor Equipment Market by Country, (2018-25), (USD million) 36

TABLE 6 APAC Consumer Electronics Semiconductor P&A Equipment Market by Country, (2018-25), (USD million) 38

TABLE 7 APAC Communications Semiconductor P&A Equipment Market by Country, (2018-25), (USD million) 39

TABLE 8 APAC Automotive Semiconductor P&A Equipment Market by Country, (2018-25), (USD million) 40

TABLE 9 APAC Industrial Semiconductor P&A Equipment Market by Country, (2018-25), (USD million) 41

TABLE 10 APAC Other Application Semiconductor P&A Equipment Market by Country, (2018-25), (USD million) 42

TABLE 11 APAC Semiconductor P&A Equipment Market Size by Country 2018-25 (USD million) 43

TABLE 12 China Semiconductor P&A Equipment Market Size by Process type (USD million) 46

TABLE 13 China Semiconductor P&A Equipment Market Size by Application (USD million) 46

TABLE 14 Japan Semiconductor P&A Equipment Market Size by Process type (USD million) 49

TABLE 15 Japan Semiconductor P&A Equipment Market Size by Application (USD million) 49

TABLE 16 India Semiconductor P&A Equipment Market Size by Process type (USD million) 53

TABLE 17 India Semiconductor P&A Equipment Market Size by Application (USD million) 53

TABLE 18 Singapore Semiconductor P&A Equipment Market Size by Process type (USD million) 55

TABLE 19 Singapore Semiconductor P&A Equipment Market Size by Application (USD million) 55

TABLE 20 South Korea Semiconductor P&A Equipment Market Size by Process type (USD million) 57

TABLE 21 South Korea Semiconductor P&A Equipment Market Size by Application (USD million) 57

TABLE 22 Taiwan Semiconductor P&A Equipment Market Size by Process type (USD million) 59

TABLE 23 Taiwan Semiconductor P&A Equipment Market Size by Application (USD million) 60

TABLE 24 Rest of APAC Semiconductor P&A Equipment Market Size by Process type (USD million) 62

TABLE 25 Rest of APAC Semiconductor P&A Equipment Market Size by Application (USD million) 62

TABLE 26 Amkor Technology Inc. Key Facts 68

TABLE 27 Product segmentation of Amkor Technology Inc. 69

TABLE 28 Amkor Technology Inc. Growth Strategy 70

TABLE 29 Amkor Technology Inc., Company Financials, (USD million) 71

TABLE 30 Fujitsu Ltd. Key Facts 73

TABLE 31 Product segmentation of Fujitsu Ltd. 74

TABLE 32 Fujitsu Ltd. (USD million) 75

TABLE 33 Toshiba Corporation Key Facts 77

TABLE 34 Product segmentation of Toshiba Corporation 78

TABLE 35 Toshiba Corporation Growth Strategy 78

TABLE 36 Toshiba Corporation, (USD million) 79

TABLE 37 Qualcomm Incorporated Key Facts 82

TABLE 38 Product segmentation of Qualcomm Incorporated Key Facts 83

TABLE 39 Qualcomm Incorporated Growth Strategy 83

TABLE 40 Qualcomm Incorporated Company Financials, (USD million) 84

TABLE 41 Renesas Electronics Corporation Key Facts 86

TABLE 42 Products segmentation of Renesas Electronics Corporation 87

TABLE 43 Renesas Electronics Corporation Growth Strategy 87

TABLE 44 Renesas Electronics Corporation Financials, (USD million) 88

TABLE 45 Samsung Electronics Key Facts 90

TABLE 46 Product Segmentation of Samsung Electronics 91

TABLE 47 Samsung Electronics Growth Strategy 91

TABLE 48 Samsung Electronics Financials, (USD million) 92

TABLE 49 Jiangsu Changjiang Electronics Technology Co. Ltd Key Facts 94

TABLE 50 Products segmentation of Jiangsu Changjiang Electronics Technology Co. Ltd 94

TABLE 51 Jiangsu Changjiang Electronics Technology Co. Ltd. Financials, (USD million) 95

TABLE 52 ChipMOS Technologies Inc. key facts 97

TABLE 53 Products Segmentation of ChipMOS Technologies Inc. 98

TABLE 54 ChipMOS Technologies Inc. Growth Strategy 98

TABLE 55 ChipMOS Technologies Inc. financials, (USD million) 99

TABLE 56 Powertech Technology Inc. key facts 101

TABLE 57 Products segmentation of Powertech Technology Inc. 102

TABLE 58 Powertech Technology Inc. Growth Strategy 102

TABLE 59 Powertech Technology Inc. Financials, (USD million) 103

TABLE 60 ASE Group Key Facts 105

TABLE 61 Products segmentation of ASE Group 106

TABLE 62 ASE Group Growth Strategy 106

TABLE 63 ASE Group Financials, (USD million) 107

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Products and Companies


Companies

Amkor Technology Inc, Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co. Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technology Inc., ASE Group

The report published" Asia Pacific Semiconductor Packaging and Assembly Equipment Market Insights to 2025 - provides a comprehensive analysis of Semiconductor Packaging and Assembly Equipment market at regional level. The report focuses on overall market size for Semiconductor Packaging and Assembly Equipment services by several Process (Plating, Inspection and Dicing, Wire Bonding, Die-Bonding and Others (including Packaging)), by applications (Consumer Electronics, Communication, Automotive, Industrial and Others), by different countries such as China, Japan, India, South Korea, Singapore, Taiwan and rest of APAC.
The report also provides a holistic view of the overall semiconductor packaging and assembly equipment market in the region as well as growth drivers, restraints, opportunities and factor analysis in terms of top investments undertaken, top product launches, major merger and acquisitions.
For an in-depth market overview, the report also includes a country wise analysis. For all the top industry players, a detailed product description, short- and long-term strategies, financials, SWOT analysis and recent developments are also included in the regional semiconductor packaging and assembly equipment market report. In addition to this, Porter 5s along with market share of leading semiconductor packaging and assembly equipment companies by application (Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Samsung Electronics Co Ltd, Jiangsu Changjiang Electronics Technology Co., Ltd, ChipMOS Technologies Inc., Powertech Technologies Inc., ASE Group, Renesas Electronics Corporation) have also been covered.
Asia Pacific Semiconductor Packaging and Assembly Equipment Market Size
In terms of revenue, the semiconductor packaging and assembly equipment in Asia Pacific has registered an astonishing growth with positive CAGR during the forecast period (2019-2025). The semiconductor packaging and assembly equipment market in Asia Pacific has witnessed an overall rise in market penetration in the last few years. The Internet of Things and automation in automobiles has boosted the semiconductor market. The usage of semiconductor ICs for automated driving, automatic braking system, GPS, power doors and windows has further escalated the market growth.
Asia Pacific Semiconductor Packaging and Assembly Equipment Market Segmentation
Segmentation by Process
The die bonding process held the dominant share in semiconductor packaging and assembly equipment market. baseband is mostly integrated into mobile and consumer electronics devices, this is propelling the dominance of die bonding in the market. Plating process is anticipated to be the fastest growing.
Segmentation by Application
Semiconductor packaging and assembly equipment technology market in Asia Pacific fetched maximum revenues from communication. On the other hand, automotive application segment is expected to display a high growth in years to come due to the increase in demand of automated automobiles.
Segmentation by Country
Taiwan takes the upper hand in the semiconductor packaging and assembly equipment technology market followed by China. Taiwan remains well ahead of China in IC fabrication as Taiwanese manufacturers have enormous advantages in technology over other countries including China.
Scope of the report:
Asia Pacific Asia Pacific Semiconductor Packaging and Assembly Equipment Market
Market Segmentation
Market Insights, by Market Insights by Process
Plating
Inspection and Dicing
Wire Bonding
Die-Bonding
Others (including Packaging)
Market Insights by Application
Consumer Electronics
Communication
Automotive
Industrial
Others
Market Insights by Geography
China
Japan
India
South Korea
Singapore
Taiwan
Rest of APAC
Top Companies Profiled
Amkor Technology Inc.
Fujitsu Ltd.
Toshiba Corporation
Qualcomm Incorporated
Samsung Electronics Co Ltd
Jiangsu Changjiang Electronics Technology Co., Ltd
ChipMOS Technologies Inc.
Powertech Technologies Inc.
ASE Group
Renesas Electronics Corporation
Reasons to buy:
The study includes market sizing and forecasting analysis validated by authenticated key industry experts
The report presents a quick review of overall industry performance at one glance
The report covers in depth analysis of prominent industry peers with primary focus on key business financials, product portfolio, expansion strategies and recent developments
Detailed examination on drivers, restraints, key trends and opportunities prevailing in the industry.
Examination of industry attractiveness with the help of Porter's Five Forces analysis
The study comprehensively covers the market across different segments
Deep dive regional level analysis of the industry
Customization Options:
The Asia Pacific Semiconductor Packaging and Assembly Equipment Market can be customized to country level or any other market segment. Besides this, UMI understands that you may have your own business need, hence we also provide fully customised solutions to clients.
READ MORE

Scope

1. MARKET INTRODUCTION 11

1.1 Market Definition 11

1.2 Objective of the Study 11

1.3 Limitation 11

1.4 Stakeholders 11

1.5 Currency used in the Report 12

2. RESEARCH METHODOLOGY OR ASSUMPTION 13

2.1 Research Methodology for Asia-Pacific Semiconductor P&A Equipment Market 13

2.1.1 Main objective of the Asia-Pacific Semiconductor P&A Equipment Market Study 14

3. INDUSTRY PERFORMANCE 15

4. EXECUTIVE SUMMARY 16

5. MARKET OVERVIEW 18

5.1 Introduction 18

5.2 Market Dynamics 19

5.2.1 Market Trend & Drivers 19

5.2.1.1 Increase in Sales of Smart Phones and Other Smart Consumer Electronic Devices 19

5.2.1.2 Improved Medical Applications and Equipment 20

5.2.1.3 Growing Scope in the Internet of Things 21

5.2.1.4 Increase in Vehicle Automation 23

5.2.2 Market Restraints 23

5.2.2.1 The requirement of High Investment 23

5.2.3 Market Opportunities 24

5.2.3.1 Rise in Use of 3D Packaging technology 24

5.2.3.2 Development of new Assembly Process 25

5.3 Key Market Indicators 26

5.3.1 Demand and Supply Side Analysis 26

5.3.1.1 Top Winning Strategies 26

5.3.1.1.1 Top Product launches 27

5.3.1.1.2 Business Expansions 28

5.3.1.1.3 Top Acquisition, Partnerships, Collaborations 28

5.3.2 Value Chain Analysis 29

6. MARKET INSIGHTS by PROCESS TYPE 31

6.1 General Overview 31

6.2 Plating 32

6.3 Inspection and Dicing 33

6.4 Wire Bonding 34

6.5 Die-Bonding 35

6.6 Others (Including Packaging) 36

7. MARKET INSIGHTS BY APPLICATION 37

7.1 General Overview 37

7.2 Consumer Electronics 38

7.3 Communication 39

7.4 Automotive 40

7.5 Industrial 41

7.6 Other Industry 42

8. MARKET INSIGHTS BY COUNTRY 43

8.1 General Overview 43

8.1.1 APAC Semiconductor P&A Equipment Market by Country, 2018-25 43

8.1.1.1 China Semiconductor P&A Equipment Market 44

8.1.1.1.1 Chinese Export Import data of Semiconductor Devices (2012-2018) 45

8.1.1.1.2 China Semiconductor P&A Equipment Market Size, 2018-25 45

8.1.1.2 Japan Semiconductor P&A Equipment Market 46

8.1.1.2.1 Production Value of Japanese Electronic Industry (2012-2017) 47

8.1.1.2.2 Japan Export Import data of Semiconductor Devices (2012-2018) 48

8.1.1.2.3 Japan Semiconductor P&A Equipment Market Size, 2018-25 48

8.1.1.3 India Semiconductor P&A Equipment Market 49

8.1.1.3.1 Key notable developments in Semiconductor & Electronic Sector 50

8.1.1.3.2 Key Government Initiative for Semiconductor & Electronic Sector 51

8.1.1.3.3 India Export Import data of Semiconductor Devices (2012-2018) 52

8.1.1.3.4 India Semiconductor P&A Equipment Market Size, 2018-25 52

8.1.1.4 Singapore Semiconductor P&A Equipment Market 53

8.1.1.4.1 Singapore Export Import data of Semiconductor Devices (2012-2018) 54

8.1.1.4.2 Singapore Semiconductors Market size and Local Production (2015-18) 54

8.1.1.4.3 Singapore Semiconductor P&A Equipment Market Size, 2018-25 55

8.1.1.5 South Korea Semiconductor P&A Equipment Market 56

8.1.1.5.1 South Korea Export Import data of Semiconductor Devices (2012-2018) 56

8.1.1.5.2 South Korea Semiconductor P&A Equipment Market Size, 2018-25 57

8.1.1.6 Taiwan Semiconductor P&A Equipment Market 58

8.1.1.6.1 Taiwan Semiconductor Equipment Market & Local Production (2015-18) 58

8.1.1.6.2 Taiwan Export Import data of Semiconductor Devices (2011-2017) 59

8.1.1.6.3 Taiwan Semiconductor P&A Equipment Market Size, 2018-25 59

8.1.1.7 Rest of APAC Semiconductor P&A Equipment Market 60

8.1.1.7.1 Malaysia Semiconductor Production, 2013-2017 (USD billion) 61

8.1.1.7.2 Malaysia Export Import data of Semiconductor Devices (2012-2018) 61

8.1.1.7.3 Rest of APAC Semiconductor P&A Equipment Market Size, 2018-25 62

9. COMPETITIVE SCENARIO 64

9.1 Porter's Five Forces Analysis 64

9.1.1 Bargaining power of Buyer 64

9.1.2 Bargaining power of Supplier 65

9.1.3 Threat of new entrants 65

9.1.4 Availability of Substitute 65

9.1.5 Industry Rivalry 65

9.2 APAC Semiconductor P&A Equipment Market Share Analysis, 2018 66

10. TOP COMPANY PROFILES 68

10.1 Amkor Technology Inc. 68

10.1.1 Key Facts 68

10.1.2 Business Description 68

10.1.3 Key Product/Services Offerings 69

10.1.4 SWOT Analysis 70

10.1.5 Key Financials 71

10.1.5.1 Revenue Split 71

10.1.6 Recent Developments 72

10.2 Fujitsu Ltd. 73

10.2.1 Key Facts 73

10.2.2 Business Description 73

10.2.3 Key Product/Services Offerings 74

10.2.4 SWOT Analysis 74

10.2.5 Key Financials 75

10.2.5.1 Revenue Split 75

10.2.6 Recent Developments 76

10.3 Toshiba Corporation 77

10.3.1 Key Facts 77

10.3.2 Business Description 77

10.3.3 Key Product/Services Offerings 78

10.3.4 SWOT Analysis 79

10.3.5 Key Financials 79

10.3.6 Revenue Split 80

10.3.7 Recent Developments 80

10.4 Qualcomm Incorporated 82

10.4.1 Key Facts 82

10.4.2 Business Description 82

10.4.3 Key Product/Services Offerings 83

10.4.4 SWOT Analysis 83

10.4.5 Key Financials 84

10.4.5.1 Revenue Split 84

10.4.6 Recent Developments 85

10.5 Renesas Electronics Corporation 86

10.5.1 Key Facts 86

10.5.2 Business Description 86

10.5.3 Key Product/Services Offerings 87

10.5.4 Growth Strategy 87

10.5.5 SWOT Analysis 88

10.5.6 Key Financials 88

10.5.6.1 Revenue Split 89

10.5.7 Recent Developments 89

10.6 Samsung Electronics Co. Ltd. 90

10.6.1 Key Facts 90

10.6.2 Business Description 90

10.6.3 Key Product/Services Offerings 91

10.6.4 SWOT Analysis 92

10.6.5 Key Financials 92

10.6.5.1 Revenue Split 93

10.6.6 Recent Developments 93

10.7 Jiangsu Changjiang Electronics Technology Co., Ltd. 94

10.7.1 Key Facts 94

10.7.2 Business Description 94

10.7.3 Key Product/Services Offerings 94

10.7.4 SWOT Analysis 95

10.7.5 Key Financials 95

10.7.5.1 Revenue Split 96

10.7.6 Recent developments 96

10.8 ChipMOS Technologies Inc. 97

10.8.1 Key Facts 97

10.8.2 Business Description 97

10.8.3 Key Product/Services Offerings 98

10.8.4 Growth Strategy 98

10.8.5 SWOT Analysis 98

10.8.6 Key Financials 99

10.8.6.1 Revenue Split 99

10.8.7 Recent developments 100

10.9 Powertech Technology Inc. 101

10.9.1 Key Facts 101

10.9.2 Business Description 101

10.9.3 Key Product/Services Offerings 102

10.9.4 Growth Strategy 102

10.9.5 SWOT Analysis 103

10.9.6 Key Financials 103

10.9.6.1 Revenue Split 104

10.9.7 Recent developments 104

10.10 ASE Group 105

10.10.1 Key Facts 105

10.10.2 Business Description 105

10.10.3 Key Product/Services Offerings 106

10.10.4 Growth Strategy 106

10.10.5 SWOT Analysis 107

10.10.6 Key Financials 107

10.10.6.1 Revenue Split 108

10.10.7 Recent developments 10


List Of Figure

FIG. 1 Research Methodology for Asia-Pacific Semiconductor P&A Equipment Market Study 13

FIG. 2 APAC Semiconductor P&A Equipment Market Size, 2018-25 (USD million) 17

FIG. 3 History of Semiconductor P&A Equipment Market 18

FIG. 4 Smartphone Unit Shipments and Sales Value in Asia Pacific, 2013-2017 19

FIG. 5 Smartphone Unit Shipments and Market share, by Company in Southeast Asia 2017 20

FIG. 6 Global Electronic Health Record market share, by Company 2016 21

FIG. 7 Number of Consumer Electronics Devices in India, 2014 and 2020, (Unit in million) 22

FIG. 8 Asia Pacific IoT connections, Current and Forecast (2018-2025) 22

FIG. 9 YoY Growth of Automotive Semiconductor vs all Semiconductor 23

FIG. 10 Investment Payback Time, for Foundries Manufacturing Nodes Smaller than 20 nm/16 nm (in months) 24

FIG. 11 Semiconductor Manufacturing Processes Overview 25

FIG. 12 Value Chain of Semiconductor P&A Equipment Market 29

FIG. 13 APAC Semiconductor P&A Equipment Market Share by Process, 2018 & 2025 (%) 31

FIG. 14 APAC Semiconductor P&A Equipment Market size by Process, 2018-25 (USD million) 31

FIG. 15 APAC Semiconductor P&A Equipment Market Share by Application, 2018 & 2025 (%) 37

FIG. 16 APAC Semiconductor P&A Equipment Value by Application, (2018-25), (USD million) 37

FIG. 17 APAC Semiconductor P&A Equipment Market Share by Country, 2018 & 2025 (%) 43

FIG. 18 YOY growth of Electronics Brand in Chinese Market (Unit: million? 44

FIG. 19 Chinese Export & Import data for Diodes, Transistors and Similar Semiconductor Devices, USD million 45

FIG. 20 China Semiconductor P&A Equipment Market Size, 2018-2025 (USD million) 45

FIG. 21 Production Value of Japanese Electronic Industry, 2011-2017 (USD million) 47

FIG. 22 Japan Export & Import data for Diodes, Transistors and Similar Semiconductor Devices, USD million 48

FIG. 23 Japan semiconductor P&A Equipment Market Size, 2018-2025 (USD million) 48

FIG. 24 India Export & Import data for Diodes, Transistors and Similar Semiconductor Devices, USD million 52

FIG. 25 India semiconductor P&A Equipment Market Size, 2018-2025 (USD million) 52

FIG. 26 Singapore Export & Import data for Diodes, Transistors and Similar Semiconductor Devices, USD million 54

FIG. 27 Singapore Semiconductors Market size and Local Production (2015-18), USD million 54

FIG. 28 Singapore semiconductor P&A Equipment Market Size, 2018-2025 (USD million) 55

FIG. 29 South Korea Export & Import data for Diodes, Transistors and Similar Semiconductor Devices, USD million 56

FIG. 30 South Korea Semiconductor P&A Equipment Market Size, 2018-2025 (USD million) 57

FIG. 31 Taiwan Semiconductors Manufacturing Market size and Local Production (2015-18), USD million 58

FIG. 32 Taiwan Export & Import data for Diodes, Transistors and Similar Semiconductor Devices, USD million 59

FIG. 33 Taiwan Semiconductor P&A Equipment Market Size, 2018-2025 (USD million) 59

FIG. 34 Malaysia Semiconductor Production, 2013-2017 (USD billion) 61

FIG. 35 Malaysia Export & Import data for Diodes, Transistors and Similar Semiconductor Devices, USD million 61

FIG. 36 Rest of APAC Semiconductor P&A Equipment Market Size, 2018-2025 (USD million) 62

FIG. 37 Porters' Five Forces Analysis on Asia-Pacific Semiconductor P&A Equipment Market 64

FIG. 38 APAC Semiconductor P&A Equipment Market Share by Company 2018 66

FIG. 39 Amkor Technology Inc., SWOT Analysis 70

FIG. 40 Amkor Technology Inc., Revenue Split, 2017 71

FIG. 41 Fujitsu Ltd., SWOT Analysis 74

FIG. 42 Fujitsu Ltd., Revenue Split, 2017 75

FIG. 43 Toshiba Corporation, SWOT Analysis 79

FIG. 44 Toshiba Corporation Revenue Split, 2018 80

FIG. 45 Qualcomm Incorporated SWOT Analysis 83

FIG. 46 Qualcomm Incorporated Revenue Split, 2018 84

FIG. 47 Renesas Electronics Corporation SWOT Analysis 88

FIG. 48 Renesas Electronics Corporation Revenue Split, 2018 89

FIG. 49 Samsung Electronics SWOT Analysis 92

FIG. 50 Samsung Electronics Revenue Split, 2017 93

FIG. 51 Jiangsu Changjiang Electronics Technology Co. Ltd. SWOT Analysis 95

FIG. 52 Jiangsu Changjiang Electronics Technology Co. Ltd 2017 96

FIG. 53 ChipMOS Technologies Inc., SWOT Analysis 98

FIG. 54 ChipMOS Technologies Inc. Revenue Split, 2018 99

FIG. 55 Powertech Technology Inc. SWOT Analysis 103

FIG. 56 Powertech Technology Inc., Revenue Split, 2017 104

FIG. 57 ASE Group, SWOT Analysis 107

FIG. 58 ASE Group Revenue Split, 2017 108


List Of Table

TABLE 1 APAC Plating Semiconductor Equipment Market by Country, (2018-25), (USD million) 32

TABLE 2 APAC Inspection & Dicing Semiconductor Equipment Market by Country, (2018-25) (USD million) 33

TABLE 3 APAC Wire Bonding Semiconductor Equipment Market by Country, (2018-25), (USD million) 34

TABLE 4 APAC Die Bonding Semiconductor Equipment Market by Country, (2018-25), (USD million) 35

TABLE 5 APAC Others Semiconductor Equipment Market by Country, (2018-25), (USD million) 36

TABLE 6 APAC Consumer Electronics Semiconductor P&A Equipment Market by Country, (2018-25), (USD million) 38

TABLE 7 APAC Communications Semiconductor P&A Equipment Market by Country, (2018-25), (USD million) 39

TABLE 8 APAC Automotive Semiconductor P&A Equipment Market by Country, (2018-25), (USD million) 40

TABLE 9 APAC Industrial Semiconductor P&A Equipment Market by Country, (2018-25), (USD million) 41

TABLE 10 APAC Other Application Semiconductor P&A Equipment Market by Country, (2018-25), (USD million) 42

TABLE 11 APAC Semiconductor P&A Equipment Market Size by Country 2018-25 (USD million) 43

TABLE 12 China Semiconductor P&A Equipment Market Size by Process type (USD million) 46

TABLE 13 China Semiconductor P&A Equipment Market Size by Application (USD million) 46

TABLE 14 Japan Semiconductor P&A Equipment Market Size by Process type (USD million) 49

TABLE 15 Japan Semiconductor P&A Equipment Market Size by Application (USD million) 49

TABLE 16 India Semiconductor P&A Equipment Market Size by Process type (USD million) 53

TABLE 17 India Semiconductor P&A Equipment Market Size by Application (USD million) 53

TABLE 18 Singapore Semiconductor P&A Equipment Market Size by Process type (USD million) 55

TABLE 19 Singapore Semiconductor P&A Equipment Market Size by Application (USD million) 55

TABLE 20 South Korea Semiconductor P&A Equipment Market Size by Process type (USD million) 57

TABLE 21 South Korea Semiconductor P&A Equipment Market Size by Application (USD million) 57

TABLE 22 Taiwan Semiconductor P&A Equipment Market Size by Process type (USD million) 59

TABLE 23 Taiwan Semiconductor P&A Equipment Market Size by Application (USD million) 60

TABLE 24 Rest of APAC Semiconductor P&A Equipment Market Size by Process type (USD million) 62

TABLE 25 Rest of APAC Semiconductor P&A Equipment Market Size by Application (USD million) 62

TABLE 26 Amkor Technology Inc. Key Facts 68

TABLE 27 Product segmentation of Amkor Technology Inc. 69

TABLE 28 Amkor Technology Inc. Growth Strategy 70

TABLE 29 Amkor Technology Inc., Company Financials, (USD million) 71

TABLE 30 Fujitsu Ltd. Key Facts 73

TABLE 31 Product segmentation of Fujitsu Ltd. 74

TABLE 32 Fujitsu Ltd. (USD million) 75

TABLE 33 Toshiba Corporation Key Facts 77

TABLE 34 Product segmentation of Toshiba Corporation 78

TABLE 35 Toshiba Corporation Growth Strategy 78

TABLE 36 Toshiba Corporation, (USD million) 79

TABLE 37 Qualcomm Incorporated Key Facts 82

TABLE 38 Product segmentation of Qualcomm Incorporated Key Facts 83

TABLE 39 Qualcomm Incorporated Growth Strategy 83

TABLE 40 Qualcomm Incorporated Company Financials, (USD million) 84

TABLE 41 Renesas Electronics Corporation Key Facts 86

TABLE 42 Products segmentation of Renesas Electronics Corporation 87

TABLE 43 Renesas Electronics Corporation Growth Strategy 87

TABLE 44 Renesas Electronics Corporation Financials, (USD million) 88

TABLE 45 Samsung Electronics Key Facts 90

TABLE 46 Product Segmentation of Samsung Electronics 91

TABLE 47 Samsung Electronics Growth Strategy 91

TABLE 48 Samsung Electronics Financials, (USD million) 92

TABLE 49 Jiangsu Changjiang Electronics Technology Co. Ltd Key Facts 94

TABLE 50 Products segmentation of Jiangsu Changjiang Electronics Technology Co. Ltd 94

TABLE 51 Jiangsu Changjiang Electronics Technology Co. Ltd. Financials, (USD million) 95

TABLE 52 ChipMOS Technologies Inc. key facts 97

TABLE 53 Products Segmentation of ChipMOS Technologies Inc. 98

TABLE 54 ChipMOS Technologies Inc. Growth Strategy 98

TABLE 55 ChipMOS Technologies Inc. financials, (USD million) 99

TABLE 56 Powertech Technology Inc. key facts 101

TABLE 57 Products segmentation of Powertech Technology Inc. 102

TABLE 58 Powertech Technology Inc. Growth Strategy 102

TABLE 59 Powertech Technology Inc. Financials, (USD million) 103

TABLE 60 ASE Group Key Facts 105

TABLE 61 Products segmentation of ASE Group 106

TABLE 62 ASE Group Growth Strategy 106

TABLE 63 ASE Group Financials, (USD million) 107

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Companies

Amkor Technology Inc, Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co. Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technology Inc., ASE Group